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Heat Deathenation Alumin nitride Ceramic Constrate

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option	Aluminum Nitride Ceramic Substrate Thermal Conductivity Over 170W/m.K
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Mofuta oa Lekhetho: T/T,Paypal
Incoterm: FOB,CFR,CIF,EXW,FCA,CPT,CIP
Min. Laela: 10 Piece/Pieces
Lipalangoang: Air,Express
Port: Shenzhen,HongKong

Phepelo Matla & Informations eketsehileng

Additional Information

Packaging: Kantle lebone

Tlhahiso: 100000 pieces/Month

Lipalangoang: Air,Express

Sebaka sa Tšimoloho: China

Matla a ho Fana: 50000 pieces/month

Setifikeiti: RoHS,REACH

HS Code: 8547100000

Port: Shenzhen,HongKong

Mofuta oa Lekhetho: T/T,Paypal

Incoterm: FOB,CFR,CIF,EXW,FCA,CPT,CIP

Litšobotsi tsa Sehlahisoa

Setšoantšo sa No.: Standard or custom-made

Mochine: Jinghui Ceramics

Place Of Origin: China

Species: Ceramic Plates

Application: Industrial Ceramic

Processing Service: Moulding

Color: Gray

Min. Wall Thickness: 0.30mm

Material: Aluminum Nitride

Max. Size: 400mm

Features: High Thermal Conductivity

Density: Higher Than 3.3g/cm3

Precision Process: Lapping, Machining

Application: Heat-sinks for Semiconductor Devices

Ho paka le ho tlisa

Ho rekisa lihlopha:	Piece/Pieces
Mofuta oa Sephutheloana:	Kantle lebone
Mohlala oa Litšoantšo:

Tlhaloso ea Sehlahisoa

Heat Deathenation Alumin nitride Ceramic Constrate Tlhaloso 1. Re ntse re fa lisekoere tse ngata, lisekoere le li-actangalar tsa li-actangalar tsa li-actalar tsa li-actalar li-celictrante 2. Bothuni bo tloaelehileng ba boea ba ho robala / substrate e koahelang 0.38, 0.5mm, 0.635m, 1.0mm, 1.0mm, 1.2mm 3. Bophahamo bo boholo ba ceramic Waiter bo ka ba ho fihla ho 400mm ho 3mm, 4mm, 5mm le boima 4. Max. Bolelele ba sekwere le sekwere tsa lisekoere le tse sephara li ka ba 400mm ka 500mm 5. Tlhaliso...

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Category: Subramic Ceramic substrate

 Lihlahisoa> > Subramic Ceramic substrate> Heat Deathenation Alumin nitride Ceramic Constrate